19 February 2008 0 views No Comment

On September 18, 2007, Pat Gelsinger demonstrated USB 3.0 at the fall Intel Developer Forum. USB 3.0 is targeted at ten times the current bandwidth, reaching roughly 5.0 Gbit/s by utilizing two additional high-speed differential pairs for “Superspeed” mode, and with the possibility for optical interconnect.The USB 3.0 specification is planned to be released in the first half of 2008, commercial products are expected to arrive in 2009 or 2010.

Backwards-Compatibility and Efficiency:

USB 3.0 is designed to be backwards-compatible with USB 2.0 and USB 1.1 and employs more efficient protocols to conserve power

The USB 3.0 Promoter Group was formed to create a SuperSpeed USB personal interconnect that can deliver over 10 times the speed of today’s connection. The technology will target fast sync-and-go transfer applications in the PC, consumer and mobile segments that are necessary as digital media become ubiquitous and file sizes increase up to and beyond 25 Gigabytes. USB (Universal Serial Bus) 3.0 will create a backward-compatible standard with the same ease-of-use and plug and play capabilities of previous USB technologies. Targeting over 10x performance increase, the technology will draw from the same architecture of wired USB. In addition, the USB 3.0 specification will be optimized for low power and improved protocol efficiency.

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